| Test Items | Test Conditions | Referenced Standards |
| Preconditioning (PC) | 1.TC: -55℃ ~ +150℃, 5 cycles（Optional）2.Bake:125°C /24H 3.Soak:MSL1 85℃/85%RH； MSL3 30℃/60%RH 4.IR Reflow: Tc= 260 (+5/-0)°C | JESD22-A113, J-STD-020 |
| High-Temperature Reverse Bias (HTRB) | Tj=Tjmax,100% rated Vr | JESD22-A108, MIL-STD-750 M1038 |
| Intermittent Operating Life (IOL) | Io@△Tj≥100℃ SMD:on/off 2min | JESD22-A122 AEC-Q101 |
| Temperature Cycling (TC) | Ta=-55+0℃/-10℃ 15min Ta=+150℃+15℃/-0℃ 15min Transfer time less than 1min | JESD22-A108 |
| Pressure Cooker Test (PCT) | Ta=121℃/100%RH, +15psig | JESD22A-102 |
| Resistance to Soldering Heat (RSH) | Sn-Pb: 260(+5/-5)°C Pb-free: 270(+5/-5)°C | JESD22-A111 SMD, B-106 PTH |
| Solderability (SD) | 245 ℃ ± 5 ℃ (Pb-free) Solder cover is over 95% | JESD22-B102 J-STD-002 |
| Electrostatic Discharge (ESD) Characteristics | HBM:C=100pf，R=1500Ω MM :C=200pf， R=0Ω | IEC61000 JESD22-A114 JESD22-A115 |
| Temperature and Humidity Test (THT) | Ta: 85±2℃ RH: 85±5% | MIL-STD-750 METHOD1021.2 |
| Forward Surge (FS/IFSM) | 8.3 ms half sine-wave | MIL-STD-750D METHOD 4066 |
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