关于我司提供的 SOD123FL/SMA/SMB/SMC 封装产品，由于两片夹焊的方式无法避免应力的释放，为提升产品整体可靠性，将会推出三片式焊接工艺. 附图 1-1
Regarding the SOD123FL/SMA/SMB/SMC package products provided by our company, as the two-piece clamp soldering methodcannot avoid the release of stress, in order to improve the overall reliability of the product, three-piece soldering will be launched. Attachment 1-1
我们继续承诺：我们的产品电性性能保持不变，符合我们的 Data Sheet，同时增加其产品在受到温度湿度变化后抗应力能力，提升其可靠性。如果贵司涉及需要 PCN 申请，请及时联系我们销售人员。我们将按照要求来提交，如果在 2024/11/15 日之前未提出需求，
我们将切换更可靠性的 CLIP 工艺的产品。
We continue to promise: The electrical parameters of our products remain the same, in line with our Data Sheet, while increasing the
stress resistance of their products to changes in high temperature and humidity, improving their reliability. If your company needs
PCN application, please contact our sales staff in time. We will submit according to the requirements. If there is no demand before
2024/11/15, we will ship to the more reliable CLIP process products.
感谢贵司对于MDD的一路既往的支持和信任！
Thank you for your support and trust in MDD all the way!
